The biggest memory manufacturers will reverse the release of DDR3 and DDR4 in 2025

The largest manufacturers Dram – Samsung Electronics, SK Hynix and Micron – are prepared for major changes in the RAM market. According to sources from the industry, they can completely stop the production of DDR3 and DDR4 modules towards the DDR5 release and the memory with a high thorn (HBM) at the end of 2025.

Leaving outdated memory standards can lead to a lack of DDR3 and DDR4 in the second half of 2025. Analysts note that after stopping the production of these modules will be under pressure and the most important supplies will depend on the Taiwanese Manufacturers, such as Nanya Technology and Winbond. Even they will not be able to fully compensate for the possible shortage.

The main reason for the refusal of DDR3 and DDR4 was the change in the priority of the industry. Large manufacturers are reoriented on the production of memory modules at high speed, in demand for segments of server solutions, artificial intelligence and cloud computing. In this respect, Winbond is planning to switch to a process process of 16 Nm, so that the memory chips of 8 Gigaby can release.

According to Nanya Technology, the Dram market will reach a minimum in the first half of 2025, after which recovery will start due to the growth in demand and improved inventory management. In the future, DDR5 and HBM, which offer higher transit and energy efficiency, will be spent on the most important attention.

Although Samsung and SK Hynix are planning to concentrate on the release of advanced memory modules, other manufacturers, including the Chinese CXMT, can take their place on the GDR4 market. Experts, however, doubt that this will fully compensate for the refusal of the largest players in the old standards. Thus the transition to the DDR5 becomes inevitable and users can encounter the increase in prices and the limited availability of modules in the coming years, depending on the DDR3 and DDR4.