Russia’s Path to Domestic Lithography by 2030: A Strategic Milestone

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If the roadmap for IPM RAS and the National Center for Physics and Mathematics receives approval, Russia is poised to launch domestic lithography production by 2030. The plan, described to socialbites.ca by a leading developer of a pioneering domestic lithography project, involves collaboration with the National Center for Physics and Mathematics and its Multilayer X-ray Optics division. Nikolai Chkhalo, head of the IPM laboratory, outlined the strategy and its anticipated milestones as the team moves from concept to practical testing.

The first phase, scheduled to unfold over two years, focuses on building the core technologies needed for X-ray lithography. During this period, the alpha apparatus will be constructed, and within two years the team expects to demonstrate a projection-lens resolution in the 32 to 28 nanometer range. This stage will enable real-scale testing of the essential lithography components, providing a tangible proof of concept and a clear path toward scalable manufacturing capabilities. The timeline is ambitious, yet the developers anticipate a rapid progression from development to early validation.

The second phase also spans two years and aims to deliver a beta machine capable of producing chips at industrial scale. This stage includes refining production workflows and integrating systems to ensure robust, repeatable outputs. The beta apparatus is projected to achieve resolutions up to 28 nanometers, aligning with the industry trend toward ever-smaller feature sizes. Comparisons with leading lithography platforms show that achieving full integration on the production line typically requires multi-year efforts, but the plan envisions completing the critical integration steps and moving to working lithographs by 2030. The trajectory envisions a line capable of delivering 28 nm, and subsequently 14 nm and 12 nm chips, reflecting modern semiconductor scaling targets and the goal of a homegrown, cutting-edge lithography ecosystem.

The discussion also touches on the historical context of sanctions and export controls related to advanced microcircuit equipment, and where Russia currently stands in relation to global trends. The ongoing efforts underscore a strategic push to reduce reliance on external suppliers and to build a domestic capability that aligns with international developments in microfabrication and nanolithography.

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