XMEMS introduced the XMC-2400 microCHip, designed to solve the problem of overheating in compact devices. Instead of traditional coolers with rotating sheets, the development uses acoustic waves to create air flow. The basis of the technology is micro -electromechanical systems (MEMS), which are usually used in miniature speakers. The chip is equipped with a Piezo -Electric film: the fluctuations are generated by the directional sound waves of the ultrasound, invisible to humans’ hearing. At the same time, energy consumption is no greater than 30 MW.
The dimensions of the device – 9.3 × 7.6 × 1.08 mm – allows you to integrate it into smartphones, tablets or server boards without increasing the size of the case. Installation is carried out by standard surface installation methods (SMT), which simplifies mass production. The chip is protected according to the IP58 stand: it is resistant to immersion in water by a meter and is resistant to dust. The bicental air flow can overcome obstacles due to a pressure of 1,000 PA per cycle.
Until now, the technology is not available in consumer devices. Gamers who are confronted with overheating smartphones, for example, must use temporary external coolers. However, experts notice the potential of solutions for creating a thinner and energy -efficient electronics. XMems emphasizes that the chip is already ready for implementation, but the appearance conditions in commercial products are not specified.
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Source: VG Times
Gregory Robert is a sports aficionado and a writer for “Social Bites”. He provides in-depth coverage of the latest sporting events and trends, offering a unique and knowledgeable perspective on the world of sports.