Japan’s Rapidus consortium has formalized a strategic collaboration with IBM to advance the development and production of next‑generation semiconductor chips. The partnership places IBM alongside a growing roster of Japanese participants that includes Toyota Motor, Sony, and SoftBank as it pursues 2‑nanometer node technology with a target production timeline set for 2027. Rapidus frames the alliance as a pivotal move in Japan’s ambition to lead in research, development, and manufacture of cutting‑edge semiconductors on the global stage.
IBM has been at the forefront of the 2‑nanometer chip development era since it unveiled the world’s first 2‑nm chip development system in 2021. The collaboration is expected to leverage IBM’s extensive legacy in semiconductor design and fabrication, bringing improvements in performance and efficiency—estimates point to substantial gains over current generations as the technology scales from theoretical capability to industrial production.
Senior IBM executive Dario Gil described the partnership as a meaningful step for the industry, aimed at strengthening a balanced global supply chain and fostering an ecosystem of like‑minded companies and nations. Under the agreement, Rapidus engineers will work closely with IBM researchers at IBM’s state‑of‑the‑art nanotechnology facilities in Albany, New York, a site renowned for its contributions to semiconductor innovation.
The Rapidus consortium’s formation was announced by a Japanese executive in the preceding month, with several notable companies already on board. In addition to the firms cited, Kioxia, Denso, NEC, NTT, and Mitsubishi UFJ Financial Group joined the effort. Earlier, Belgian firm IMEC disclosed a cooperation agreement with Rapidus, signaling a broader international effort. Additional American and European participants are anticipated to join as the project progresses.
Fiscal support from the Japanese government has been substantial, including an initial investment of about 70,000 million yen, roughly 480 million euros, to help establish the consortium. The plan calls for starting production activities for 2‑nanometer semiconductors around 2027, with national leadership seeking to bolster domestic industry resilience and reduce dependence on external suppliers. Government officials have highlighted the goal of reinforcing supply chain security and maintaining competitiveness amid shifting global dynamics, including the evolving stance of regional chip producers and supply partners.