Apple Eyes RCC-Coated Copper Boards to Free Space Inside the Smartphone
In 2025, Apple is poised to pilot a compact motherboard built with polymer-coated copper components, known as RCC, a move designed to reclaim space inside the smartphone chassis. This is the outcome of discussions reported by 9to5Mac, which cites insights from Ming-Chi Kuo of TF International Securities. The shift to RCC could mark a meaningful change in how future iPhones are designed and assembled, with implications for device thickness and internal routing.
Industry observers note that RCC technology promises to shrink motherboard thickness. By using polymer-coated copper instead of conventional materials, engineering teams may reduce the overall height of the board, creating more internal headroom for other components or allowing slimmer device profiles. This potential space saving arises because RCC sheets can streamline the stacking and drilling processes used in board manufacturing, a virtue highlighted by Kuo, who points to the absence of fiberglass in RCC sheets as a factor that simplifies drilling and potentially lowers manufacturing risk.
According to the analyst, Apple has already begun exploring RCC in its laboratories. However, the timeline for consumer release shifts away from the next model, as durability tests remain a hurdle. Prototypes of RCC boards have shown fragility during drop tests, a challenge that must be overcome before mass production can begin. This caution suggests Apple may reserve RCC-equipped boards for later iPhone generations, while continuing to evaluate performance under real-world conditions.
On the supply side, Ajinomoto currently stands as the leading material supplier for RCC. The collaboration between Apple and Ajinomoto is viewed as a critical factor in the successful integration of RCC features. If both partners can align on development milestones before the third quarter of 2024, the technology could be ready for incorporation into iPhone 17 models arriving in 2025, according to Kuo’s projections. The emphasis remains on ensuring material compatibility, reliability, and scalable manufacturing processes as key success metrics for this transition.
Beyond the RCC storyline, Apple has faced challenges linked to thermal performance in recent devices. The overheating issue observed with the iPhone 15 Pro has been a focal point for engineers and users alike. While RCC is not a direct remedy for thermal limits, the broader goal remains to optimize internal layouts to improve heat distribution and efficiency. If RCC advances, it could contribute to lighter, slimmer designs that maintain or even improve thermal performance, provided cooling channels and heat sinks are thoughtfully reengineered to match new board geometries.
Overall, industry chatter suggests that RCC represents a strategic bet for Apple: a way to compress the internal footprint without sacrificing component performance. By embracing polymer-coated copper, Apple could unlock new possibilities for sensor arrays, wireless bands, and power management circuits within the same or reduced chassis volume. The success of this approach will hinge on durability, manufacturability, and the ability to scale production in line with iPhone release cadences. As the company continues to validate RCC in controlled settings, enthusiasts and investors will watch closely for updates on prototype reliability, testing milestones, and any sightings of RCC-configured boards in forthcoming hardware trials.
In summary, RCC technology is positioned as a potential catalyst for slimmer, more compact iPhone designs in the near term. While the iPhone 16 may not feature RCC-based boards, ongoing development signals a likely pathway toward broader adoption in 2025 and beyond, contingent on successful durability tests and the efficient partnership between Apple and Ajinomoto. The broader narrative remains a careful balance between groundbreaking materials science and pragmatic manufacturing realities, with RCC serving as a symbol of how the next generation of Apple devices could redefine internal architecture.