In 2025, Apple will be the first company to use a compact motherboard with polymer-coated copper (RCC) components, allowing engineers to save space inside smartphones. In this respect reports The 9to5Mac publication quotes insider and analyst TF International Securities Ming-Chi Kuo.
“RCC will reduce the thickness of the motherboard and thus save space inside the case. RCC will also make the drilling process easier since there is no fiberglass in such sheets, Kuo said.
According to the analyst, Apple is already experimenting with RCC, but does not expect this technology to be released on the iPhone 16. The fact is that new types of boards have not yet passed durability tests. The fragility of prototypes is especially evident during test drops.
“Today, RCC’s leading material supplier is Ajinomoto. “If Apple and Ajinomoto can develop RCC features before the third quarter of 2024, the new motherboards will be used in iPhone 17 models in 2025,” Kuo concluded.
Previously Apple I couldn’t do it Solve iPhone 15 Pro overheating issue.