Taiwan’s premier chipmaker, TSMC, is poised to widen the slate of customers adopting its 3 nanometer process well into 2024 and beyond. The shift reflects rising demand for top-tier silicon and is reported by Wccftech, citing China Times as the source. The move signals a broader push to scale advanced nodes across multiple device categories rather than limiting the technology to smartphones alone.
The 3nm initiative is set to reach a broader audience, extending past traditional smartphone chipmakers. While names like MediaTek and Qualcomm remain in the mix, TSMC is also entering the realm of graphics processing units for next‑generation devices. Notably, the company plans to manufacture 3nm chips for Nvidia graphics accelerators and will supply AI processors to major cloud and technology firms including Microsoft, Google, and Amazon, underscoring its role in powering cutting-edge AI and computing workloads.
Current production of hollow silicon wafers for 3nm chips runs at a monthly pace of roughly 60,000 to 70,000 units. TSMC aims to lift output to about 100,000 wafers per month by year‑end 2024, a move that could strengthen its share in the high‑performance silicon market. The revenue contribution from 3nm products is expected to rise from around five percent this year to roughly ten percent in the coming year, highlighting the growing importance of the 3nm family within the company’s overall business mix.
TSMC’s 3nm journey began in earnest with a major early customer in 2023, Apple. In Taiwan, the company produced the A17 Pro and M3 processors destined for American devices, aligning with the launch of the iPhone 16 Pro and new Mac computers for the year. This milestone demonstrates TSMC’s capacity to deliver leading‑edge silicon to major device families across the globe, including North American markets, and reflects the strong collaboration between Taiwanese manufacturers and North American tech ecosystems.
Industry chatter suggests the first 3nm chips for the Android ecosystem will include Qualcomm’s Snapdragon 8 Gen4 and MediaTek’s Dimensity 9400, signaling continued competition and cooperation among leading chip designers as the 3nm era expands. The next wave of devices across flagship smartphones and premium Android handsets may increasingly rely on these advanced nodes for enhanced performance and energy efficiency, a trend that resonates deeply with Canadian and American consumers who demand faster, more efficient devices.
In related discussions, rumors have touched on future flagship models such as Redmi’s budget‑friendly K70e, illustrating how competitive product lines are evolving as 3nm production scales. While such rumors circulate, the core business trend remains clear: TSMC is accelerating the deployment of its 3nm platform to satisfy a diverse and growing customer base, with North American and global technology ecosystems closely watching the rollout and its impact on device performance, supply chains, and regional competitiveness. Citations: Wccftech and China Times provide industry context for these developments, with ongoing coverage noting the strategic importance of Taiwan‑based semiconductor manufacturing to the broader North American tech landscape.