Russian specialists were able to replace imported solutions for copper plating of circuit boards of electronic devices. This was reported by the press service of the Russian Chemical-Technological University. D.I. Mendeleev.
When creating chips and multilayer boards, one of the basic operations is to coat the dielectric base with a layer of copper conductor in the right places. This is done by chemically precipitation from a solution and the technology is considered very delicate and laborious. The more complex the creation of the device, the more important it is to comply with both the composition of the solution and the deposition conditions. At the same time, the delivery of both the solution and its components and production equipment to Russia was difficult due to the deterioration of relations with Western countries.
Now Venera Aleshina and her colleagues were able to replace imported solutions for applying copper plating. “At this stage, the business comes to a logical conclusion. A chemical copper plating solution has been developed, which is not inferior to the foreign analogue in terms of technological parameters (stability, deposition rate) and properties of deposited coatings (continuity, uniformity and compactness in the holes), as well as domestic copper plating. Electrolyte, which makes it possible to obtain coatings (both inside the holes and on the surface) for through-holes of sheets, comparable in uniformity and brightness to a foreign analogue, ”said the scientist.
Thanks to the reinforcement of the Innovative Materials Department, the authors were able to carry out all the experiments in a short time to select an organic additive complex to ensure the necessary scattering power of the electrolyte and the uniformity of the copper coatings in the holes. and Corrosion Protection with inverted metallurgical microscope and other modern equipment. The Swedish Electroless Copper PEC 670 served as a model for the development of the chemical deposition solution and the German Cupracid TP3 for electricity.
Pilot tests should be conducted in the second half of 2023.
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